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Die-Attach film (DAF) adhesive has become popular and mandatory when stack chips are used to accomplish larger capacity in 3-D packaging of flash memory devices.Camera Magnification Pre Bond/Bond Post Bon. The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked die bonders and die sorting equipment Die Attach. ë°€ DIE Attach 장비ĭie Attach Besi offers a wide range of die attach systems based on leading-edge technology.Die Attach (Die Mount 혹은 Die Bond) ê³µì

Fig.1 Examples of Die bonders Kulicke&Soffa's E8088 (left), ESC's Apollo 3000 (right) 2.